What You Should Already Know:
There are no prerequisites for this course.
This course explains the advantages and challenges of area grid arrays, including component descriptions and terminology. Provides a visual overview of the removal and replacement procedures for BGAs and QFNs, using both convection and IR equipment. The course will also cover site preparation, reballing, component alignment, solder paste printing, preheating considerations and thermal profiles.
Potential problems are explored, including moisture sensitivity, heating of adjacent components and solder joints, and soldering defects including misalignment, missing balls, voids, opens and shorts and partial or no reflow. Detailed X-ray analysis for solder joint inspection and evaluation as well as direct transmission and CT inspection are reviewed.
- Demonstrate best practices in area array rework
- Improved knowledge for potential problems with area array rework
- Demonstrate improved x-ray analysis on solder joints
- Improved site preparation for reworking assemblies
Course Time: 23 Minutes
Testing & Certification:
A Certificate of Completion will be issued to the student upon completion of the testing requirement of the course. A passing grade of 70% is needed to receive the certificate. The student will be allowed to take the test three times. If a passing grade is not achieved after the third test, the course will be locked and the student will have to repurchase the course.