What You Should Already Know:
There are no prerequisites for this course
This course provides the latest package styles for various components, keeping you up to date as components continuously change in size and shape. The program begins by explaining the function of active and passive electronic components, reviews the basic through-hole and surface mount assembly processes, and covers component part numbers, bill of materials, component reference designators, markings, orientation, and polarity.
The course identifies all of the important through-hole and surface mount component types – including: through-hole resistors, capacitors, diodes, potentiometers, pin grid arrays, sockets, DIPs, SIPs, transistors, LEDs, inductors, chokes, toroid’s, filters, fuses, breakers, switches, relays, crystals, voltage regulators, thermistors, connectors, sockets, headers, and jumpers. Also covered, SMT component types (QFPs, PLCCs, rectangular chips, MELFs, SOICs, molded tantalum capacitors, SOTs, DPAKs), leadless components, QFNs, DFNs, LGAs, CCGAs and BGAs. The course will introduce resistor, capacitor and inductor values and tolerances as well.
- Expands Your Knowledge Base in Component Identification
- Provides Background Knowledge for Component Functionality
- Improved Communication Using Common Electronic Assembly Components
- Demonstrate Proper Orientation and Usage of Electronic Components
Course Time: 49 Minutes
Testing & Certificate:
A Certificate of Completion will be issued to the student upon Completion of the testing requirement of the course. A passing grade of 70% is needed to receive the certificate. The student will be allowed to take the test a total of 3 times to achieve a passing grade.