What You Should Already Know:
There are no prerequisites for this course.
The component level defects/acceptance criteria for IPC-A-610F course, provides operator level training in acceptance criteria for components on printed circuit boards. The acceptance criteria for surface mount and through hole components is demonstrated in high-quality images throughout the course.
The course will instruct operators how to properly evaluate; product classes, lead forming, stress relief, bend radius, end seals damage, and damaged leads. Additional topics covered are; angled / tilted components, component height, minimum electrical clearance, lead protrusion, maximum design height, and clearance for heat dissipative components. Other topics covered in the course are; hole obstruction, component staking, adhesive bonding, adhesive on lands, loss of metallization on components, damaged components (chip outs), component markings, burned components, cracked components, dented components, damaged insulation, connector pins and press fit pins.
This course explains the critical component level defects from IPC-A-610F, but does not replace IPC-A-610F CIS Certification. It can be useful for operators who need supplemental preparation for CIS training, or who do not need IPC certification. This is a great course for new operators.
• Improve quality of finished boards
• Demonstrate understanding of acceptance criteria for IPC-A-610F
• Improve evaluation methods of finished boards
Course Time: 30 Minutes
Testing & Certification:
A Certificate of Completion will be issued to the student upon completion of the testing requirement of the course. A passing grade of 70% is needed to receive the certificate. The student will be allowed to take the test three times. If a passing grade is not achieved after the third test, the course will be locked and the student must repurchase the course.