Surface Mount Solder Joint Quality Standards, Class 3

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What You Should Already Know:

There are no prerequisites for this course

Course Description:

IPC-A-610F, Acceptability of Electronic Assemblies is one of the industry’s most popular used and recognized standard. This course will focus on the requirements for surface mount solder joint criteria as outlined in IPC-A-610F. Some of the key acceptance requirements covered are for Chip, J-Lead, and Gull Wing solder joints. Solder joint quality standards for two new area array component types: Ball Grid Arrays (BGAs) and Bottom Termination Components (BTCs) will covered as well. In this course you will be able to select from class 3 acceptance criteria. Course contents will cover quality standards for dimensional criteria, such as end overhang, side joint width, fillet height and others. Defect identification for such conditions as solder balls, blowholes, solder webbing, chip-outs, non-coplanarity, incomplete reflow and others are shown. This is an essential course for any operator using IPC-A-610F in the work place especially in regards to surface mount solder joints.

Learning Outcomes:

  • Improved understanding of surface mount solder joint acceptability
  • Demonstrate understanding of visual criteria for class 3 requirements
  • Able to explain visual criteria for solder defects
  • Become more fluent in surface mount solder joint terminology
  • Improved functional usage of IPC-A-610F

Course Time: 36 Minutes

Testing & Certificate:

 A Certificate of Completion will be issued to the student upon completion of the testing requirement of the course. A passing grade of 70% is needed to receive the certificate. The student will be allowed to take the test a total of 3 times to achieve a passing grade.

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